Tesi etd-07172018-170930
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Tipo di tesi
Dottorato
Autore
PREITE, MASSIMO VALERIO
URN
etd-07172018-170930
Titolo
Design and characterization of Silicon Photonics components for Data and Telecom applications
Settore scientifico disciplinare
ING-INF/03
Corso di studi
INGEGNERIA - Ph.D. Programme in Emerging Digital Technologies (EDT)
Commissione
relatore Prof. DI PASQUALE, FABRIZIO CESARE FILIPPO
Parole chiave
- datacom
- Mach-Zehnder
- Multiplexer
- optical communications
- optical interconnect
- polarization control
- Radio Access Network
- ROADM
- Silicon photonics
- switching
- telecom
Data inizio appello
13/12/2018;
Disponibilità
completa
Riassunto analitico
This thesis presents the study and development of Silicon Photonics integrated circuits for telecom and datacom applications.
Silicon photonics fosters on the advanced silicon technology and production infrastructure to mass produce low footprint and low power photonic integrated circuits (PIC) to replace their traditional discrete counterparts.
The sustained growth of traditional internet traffic, together with appearance and diffusion of mobile traffic from smartphones and IOT devices, new features like cloud and media services have produced an increasing demand for more bandwidth.
To meet this demand, optical networks are being deployed increasingly closer to the final user. An efficient management of access networks requires optical systems enabling to reconfigure network connections from remote and by software. On the one hand, this is already done since a decade in core and metro segments, but current equipment is still too costly, unwieldy and power consuming for being practical in access networks.
On the other hand, the demand for a large volume of small and low consumption devices greatly favours silicon photonics over traditional implementations.
Within the mini ROADM project, a silicon photonic integrated optical cross connect has been designed and characterized. The project was a third party collaboration with Ericsson and the chips were fabricated by IMEC. System level tests like BER curve measurements have been performed.
The system is intended for use in Radio Access Networks (RAN) for mobile traffic.
Also, the operation of the polarization control module inside this chip has been analysed and tested.
Also, the evolution of data centres towards larger facilities needs a paradigm change to tackle the ever increasing bandwidth and curb power consumption.
For current data centres power consumption has become a serious issue, and the trend is to put equipment further apart than before to improve their power usage effectiveness (PUE), even distributing them in distinct buildings several km apart from each other. The rising distances and bit rates increase have brought to the substitution of electrical cable with optical fibers for rack to rack interconnects and this trend is taking for board to board and even chip to chip communications.
As a result, Datacom is projected to be the largest market for silicon photonics.
The IRIS project, funded by the seventh European Framework Program (FP7), has seen the design and development of a silicon photonics Transponder Aggregator (TPA) for datacom applications.
Silicon photonics fosters on the advanced silicon technology and production infrastructure to mass produce low footprint and low power photonic integrated circuits (PIC) to replace their traditional discrete counterparts.
The sustained growth of traditional internet traffic, together with appearance and diffusion of mobile traffic from smartphones and IOT devices, new features like cloud and media services have produced an increasing demand for more bandwidth.
To meet this demand, optical networks are being deployed increasingly closer to the final user. An efficient management of access networks requires optical systems enabling to reconfigure network connections from remote and by software. On the one hand, this is already done since a decade in core and metro segments, but current equipment is still too costly, unwieldy and power consuming for being practical in access networks.
On the other hand, the demand for a large volume of small and low consumption devices greatly favours silicon photonics over traditional implementations.
Within the mini ROADM project, a silicon photonic integrated optical cross connect has been designed and characterized. The project was a third party collaboration with Ericsson and the chips were fabricated by IMEC. System level tests like BER curve measurements have been performed.
The system is intended for use in Radio Access Networks (RAN) for mobile traffic.
Also, the operation of the polarization control module inside this chip has been analysed and tested.
Also, the evolution of data centres towards larger facilities needs a paradigm change to tackle the ever increasing bandwidth and curb power consumption.
For current data centres power consumption has become a serious issue, and the trend is to put equipment further apart than before to improve their power usage effectiveness (PUE), even distributing them in distinct buildings several km apart from each other. The rising distances and bit rates increase have brought to the substitution of electrical cable with optical fibers for rack to rack interconnects and this trend is taking for board to board and even chip to chip communications.
As a result, Datacom is projected to be the largest market for silicon photonics.
The IRIS project, funded by the seventh European Framework Program (FP7), has seen the design and development of a silicon photonics Transponder Aggregator (TPA) for datacom applications.
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