Tesi etd-08142020-175726
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Tipo di tesi
Master di Primo Livello
Autore
COLANTONIO, MATTEO
URN
etd-08142020-175726
Titolo
Beamforming in nanophotonic membrane integrated circuit for free-space sensing and metrology
Struttura
Istituto di Tecnologie della Comunicazione, dell'Informazione e della Percezione
Corso di studi
Corsi Alta Formazione - PHOTONIC INTEGRATED CIRCUITS, SENSORS AND NETWORKS (PIXNET)
Commissione
relatore CASTOLDI, PIERO
Relatore POGORETSKIY, VADIM
Relatore JIAO, YUQING
Relatore POGORETSKIY, VADIM
Relatore JIAO, YUQING
Parole chiave
- alignment
- metamaterial
- optical antennas
- optical metrology
- sub-wavelength gratings
Data inizio appello
08/09/2020;
Disponibilità
completa
Riassunto analitico
Abstract—Optical wafer metrology for semiconductor devices
manufacturing relies on laser-based phase-grating sensors to
measure the alignment of the wafer to the lithography system.
This sensor can guarantee sub-nanometer accuracy but lacks
the ability to measure multiple wafer locations at the same
time. Here, a first effort was made to provide a solution that
can map the wafer grid in a single step, thus increasing the
throughput, by employing photonic integrated circuits. The main
focus of this work was on developing optical integrated antennas
as a key enabling device of such circuits. Analytic model and
simulation results of antennas based on sub-wavelength gratings
showed the possibility to produce beam widths from 6° to 0.1°
and arbitrary sidelobe ratios along one direction in a single
lithography step. The beam shape in the orthogonal direction
was controlled through a phased array of these antennas. These
results indicate that there is a possibility of building alignment
sensors based on the simulated antennas, such as the circuits
proposed at the end of this article.
manufacturing relies on laser-based phase-grating sensors to
measure the alignment of the wafer to the lithography system.
This sensor can guarantee sub-nanometer accuracy but lacks
the ability to measure multiple wafer locations at the same
time. Here, a first effort was made to provide a solution that
can map the wafer grid in a single step, thus increasing the
throughput, by employing photonic integrated circuits. The main
focus of this work was on developing optical integrated antennas
as a key enabling device of such circuits. Analytic model and
simulation results of antennas based on sub-wavelength gratings
showed the possibility to produce beam widths from 6° to 0.1°
and arbitrary sidelobe ratios along one direction in a single
lithography step. The beam shape in the orthogonal direction
was controlled through a phased array of these antennas. These
results indicate that there is a possibility of building alignment
sensors based on the simulated antennas, such as the circuits
proposed at the end of this article.
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