Tesi etd-11052024-171506
Link copiato negli appunti
Tipo di tesi
Corso Ordinario Secondo Livello
Autore
BRACCIA, ANGELA
URN
etd-11052024-171506
Titolo
SpiCE : Design, Development and Characterization of a Novel Neural Interface
Struttura
Classe Scienze Sperimentali
Corso di studi
INGEGNERIA - INGEGNERIA
Commissione
relatore Prof. MICERA, SILVESTRO
Tutor Prof. GRECO, FRANCESCO
Presidente Prof.ssa BOGONI, ANTONELLA
Membro Dott.ssa CREA, SIMONA
Membro Prof. ABENI, LUCA
Membro Prof. ANDREUSSI, TOMMASO
Membro Prof. AVIZZANO, CARLO ALBERTO
Membro Prof. CASTOLDI, PIERO
Membro Prof. ODDO, CALOGERO MARIA
Membro Prof. RICOTTI, LEONARDO
Tutor Prof. GRECO, FRANCESCO
Presidente Prof.ssa BOGONI, ANTONELLA
Membro Dott.ssa CREA, SIMONA
Membro Prof. ABENI, LUCA
Membro Prof. ANDREUSSI, TOMMASO
Membro Prof. AVIZZANO, CARLO ALBERTO
Membro Prof. CASTOLDI, PIERO
Membro Prof. ODDO, CALOGERO MARIA
Membro Prof. RICOTTI, LEONARDO
Parole chiave
- 3D Micro-Spines
- Hybrid Neural Interface
- Microfabrication
- Peripheral Nerve Stimulation
- Soft Flexible Electrode
Data inizio appello
09/12/2024;
Disponibilità
parziale
Riassunto analitico
Objective: Peripheral nerve interfaces (PNIs) are critical tools for studying and modulating neural activity in clinical and research settings. However, balancing invasiveness and selectivity remains challenging. Extraneural devices are minimally invasive but less selective, while intraneural devices are highly selective but more invasive. The Self-Inserting Peripheral Cuff Electrode (SpiCE) addresses these limitations by combining a minimally invasive 3D micro-spine design with a flexible 2D substrate, enhancing neural interfacing performance and long-term stability.
Materials and Methods: SpiCE integrates a polyimide (PI)-based flexible substrate with titanium (Ti) and platinum (Pt) conductive tracks and gold (Au) active sites. The nerve-interfacing portion measures 3750 × 6250 μm, featuring 20 active sites (ASs) arranged in a 5 × 4 grid, spaced 750 μm radially and 600 μm axially. Each AS accommodates a 25 μm-diameter gold micro-spine, 150 μm long, for epineurium penetration. High-aspect-ratio spines were fabricated via thermosonic wire bonding, coated with a 5 μm Parylene-C layer for electrical insulation, and shaped using laser cutting for optimal insertion. A 150 μm PDMS layer was incorporated to provide mechanical flexibility and secure fastening, while a biodegradable dextran coating was applied to protect the spines during handling and implantation. SEM and optical microscopy assessed structural integrity and fabrication accuracy. A preliminary mechanical test on an explanted rat sciatic nerve evaluated spine penetration, while an in vivo test assessed implantation feasibility of two devices.
Results: The fabrication process consistently produced flexible electrodes with 20 gold spines each. SEM confirmed precise spine fabrication (length: 152 ± 17 μm) and uniform dextran coatings. Strong adhesion between PDMS, Parylene-C, and PI ensured robust integration. The mechanical test demonstrated successful penetration without spine deformation. In vivo implantation, completed in under one minute per device, validated ease of use, with the PDMS layer enabling secure fastening and the dextran coating dissolving rapidly. Post-implantation analysis confirmed intact spines, suggesting safe and effective penetration.
Conclusions: SpiCE is a novel intraneural interface offering high customizability, ease of implantation, and minimal invasiveness. Its fabrication process integrates advanced lithographic, wire bonding, and laser cutting techniques with high reliability and reproducibility. Preliminary results support SpiCE’s potential for targeted neural interfacing, paving the way for further evaluations, including electrochemical tests, to optimize functionality and long-term stability.
Materials and Methods: SpiCE integrates a polyimide (PI)-based flexible substrate with titanium (Ti) and platinum (Pt) conductive tracks and gold (Au) active sites. The nerve-interfacing portion measures 3750 × 6250 μm, featuring 20 active sites (ASs) arranged in a 5 × 4 grid, spaced 750 μm radially and 600 μm axially. Each AS accommodates a 25 μm-diameter gold micro-spine, 150 μm long, for epineurium penetration. High-aspect-ratio spines were fabricated via thermosonic wire bonding, coated with a 5 μm Parylene-C layer for electrical insulation, and shaped using laser cutting for optimal insertion. A 150 μm PDMS layer was incorporated to provide mechanical flexibility and secure fastening, while a biodegradable dextran coating was applied to protect the spines during handling and implantation. SEM and optical microscopy assessed structural integrity and fabrication accuracy. A preliminary mechanical test on an explanted rat sciatic nerve evaluated spine penetration, while an in vivo test assessed implantation feasibility of two devices.
Results: The fabrication process consistently produced flexible electrodes with 20 gold spines each. SEM confirmed precise spine fabrication (length: 152 ± 17 μm) and uniform dextran coatings. Strong adhesion between PDMS, Parylene-C, and PI ensured robust integration. The mechanical test demonstrated successful penetration without spine deformation. In vivo implantation, completed in under one minute per device, validated ease of use, with the PDMS layer enabling secure fastening and the dextran coating dissolving rapidly. Post-implantation analysis confirmed intact spines, suggesting safe and effective penetration.
Conclusions: SpiCE is a novel intraneural interface offering high customizability, ease of implantation, and minimal invasiveness. Its fabrication process integrates advanced lithographic, wire bonding, and laser cutting techniques with high reliability and reproducibility. Preliminary results support SpiCE’s potential for targeted neural interfacing, paving the way for further evaluations, including electrochemical tests, to optimize functionality and long-term stability.
File
| Nome file | Dimensione |
|---|---|
Ci sono 1 file riservati su richiesta dell'autore. |
|